Product Name: Tantalum Nitride (TaN)
Specification: 0.8-10um (D50)
Appearance: Irregular
Color: Black Grey
Features: high hardness, wear resistance, chemical inertness, thermal stability, and low temperature coefficient of resistance
Application: Wear resistant coating, thin film resistor, and diffusion barrier in integrated circuits
tantalum nitride
CAS number: 12033-62-4
Density: 13.4 g/cm3
Crystal form: Black hexagonal crystal
Melting point: 3090 ° C
chemical formula: TaN
Electrical resistivity: 128 μ Ω· cm
Thermal conductivity: 9.54W/(m · K)
Molecular weight: 194.95500
Accurate quality: 194.95100
Microhardness: 1100kg/m2
Thermal conductivity: 9.54W/(m · K)
Lattice constant: a=0.4336nm，c=0.4150nm
Water solubility: insoluble in water and acid, slightly soluble in aqua regia, soluble in potassium hydroxide and decomposed to release ammonia. Heating to 2000 ℃ releases nitrogen gas.
Preparation method
1. Metal tantalum powder is directly nitrided with nitrogen or ammonia at around 1100 ℃.
2. Preparation of tantalum nitride using tantalum metal and nitrogen gas as raw materials, the reaction equation is as follows: 2Ta+N2=2TaN
Metal tantalum powder is directly nitrided with nitrogen or ammonia at around 1100 ℃.
Function/Application
1. The material used to manufacture precise sheet resistors, tantalum nitride resistors can resist the erosion of water vapor. In the process of manufacturing integrated circuits, these films are deposited on top of silicon chips to form thin film surface mount resistors. The material used to manufacture sheet resistors, tantalum nitride resistors can resist the erosion of water vapor. Tantalum nitride material is used to make protective layers for chip wires.
2. Used as an additive for superhard materials, pure tantalum pentachloride can be prepared for spraying, increasing the electrical stability of transformers, integrated circuits, and diodes.
Storage method: This product should be sealed and stored in a dry and cool environment. It should not be exposed to air for a long time to prevent moisture from causing aggregation, affecting dispersion performance and usage effect. In addition, it should be avoided from heavy pressure and not in contact with oxidants. It should be transported as ordinary goods.
